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78 积分 2024-01-23 加入
Curing Kinetics and Mechanical Properties of Epoxy–Cyanate Ester Composite Films for Microelectronic Applications
4个月前
已完结
Effective Build-Up Substrate Design for Warpage Reduction and Reliability Enhancement in Advanced Semiconductor Packages
4个月前
已完结
SoW-X: A Novel System-on-Wafer Technology for Next Generation AI Server Application
4个月前
已完结
Mechanical and Thermal Characterization of TSV Multi-chip Stacked Packages for Reliable 3D IC Applications
4个月前
已完结
Novel insights into the multistep chlorination of silver nanoparticles in aquatic environments
4个月前
已完结
Giant Piezoelectric Coefficient of Polyvinylidene Fluoride with Rationally Engineered Ultrafine Domains Achieved by Rapid Freezing Processing
5个月前
已完结
2.5D and 3D Heterogeneous Integration: Emerging applications
5个月前
已完结
From Organic to Glass Core substrates: the journey of IC substrates to enable AI and HPC systems
5个月前
已完结
Permeable, three-dimensional integrated electronic skins with stretchable hybrid liquid metal solders
6个月前
已完结
Adhesive-free bonding of PI/PDMS interface by site-selective photothermal reactions
6个月前
已完结
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