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86 积分 2024-01-23 加入
Development of Embedded Multi Si Bridge Package in Panel Level Process for HPC/AI Applications
2天前
已完结
Glass Platform for Co-Packaged Optics
2个月前
已完结
Effect of partial substitution of barium oxide by lanthanum oxide on the structure and properties of iron-based aluminosilicate glass
2个月前
已完结
Piezoelectric dispenser printing and intense pulse light sintering of AgNW/PEDOT:PSS hybrid transparent conductive films
2个月前
已完结
Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO2 Thin Films
2个月前
已完结
A High Throughput Two-Stage Die-to-Wafer Thermal Compression Bonding Scheme for Heterogeneous Integration
2个月前
已完结
Cu Fully Filled Ultra-Fine Blind Via on Flexible Substrate for High Density Interconnect
3个月前
已完结
Flexible Integrated Battery on System-in-Package (SiP) for Internet of Things (IoT) and Smart Wearables
3个月前
已完结
Demonstration of Glass-based 3D Package Architectures with Embedded Dies for High Performance Computing
3个月前
已完结
2.5D Glass Panel Embedded (GPE) Packages with Better I/O Density, Performance, Cost and Reliability than Current Silicon Interposers and High-Density Fan-Out Packages
3个月前
已完结
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