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8 积分 2025-07-03 加入
Structure–Property Relationship of Co-PI Film Made by Incorporating 1,2,4,5-Benzenetetracarboxylic Anhydride into 3,3',4,4'-Biphenyltetracarboxylic Dianhydride/P-Phenylenediamine
3个月前
已完结
CFD Modeling the Cooling Stage of Reflow Soldering Process
7个月前
已完结
Modeling, Analysis, and Simulation of Soldering Process for FPC Connector
7个月前
已完结
Thermal conductivity enhancement of polyimide films filled with BN and AlN fillers
1年前
已完结
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