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Structure–Property Relationship of Co-PI Film Made by Incorporating 1,2,4,5-Benzenetetracarboxylic Anhydride into 3,3',4,4'-Biphenyltetracarboxylic Dianhydride/P-Phenylenediamine
6个月前
已完结
CFD Modeling the Cooling Stage of Reflow Soldering Process
9个月前
已完结
Modeling, Analysis, and Simulation of Soldering Process for FPC Connector
9个月前
已完结
Thermal conductivity enhancement of polyimide films filled with BN and AlN fillers
1年前
已完结
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