Lv11
10 积分 2025-06-18 加入
Fabrication of Conductive Copper Films on Flexible Polymer Substrates by Low-Temperature Sintering of Composite Cu Ink in Air
35分钟前
待确认
A molecular pathway to corrosion-resistant printable copper
2小时前
已完结
Self-reducible copper complex inks with aminediol and OH-based solvent for the fabrication of a highly conductive copper film by calcination at low temperature under an air atmosphere
13天前
已完结
Fabrication of Conductive Copper Films on Flexible Polymer Substrates by Low-Temperature Sintering of Composite Cu Ink in Air
13天前
已完结
Antioxidant High‐Conductivity Copper Pastes Based on Core–Shell Copper Nanoparticles for Flexible Printed Electronics
1个月前
已完结
Low-temperature sinterable copper paste with a flake-spherical hybrid network and enhanced anti-oxidation properties
1个月前
已完结
Pressureless sinter-joining of copper pastes below 200 °C via multi-solvent collaborative engineering
5个月前
已完结
A Novel High-Performance, High-Power Double-Sided Cooling SiC Power Module Based on Low-Temperature Pressureless Nano-Cu Sintering
5个月前
已完结
Preparation of High Shear Strength Self‐Reduced Nanocopper Paste and Fracture Behavior Study of Sintering Joint
5个月前
已完结
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