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40 积分 2025-06-18 加入
A molecular pathway to corrosion-resistant printable copper
2个月前
已完结
Oxidation-Free Sintered Copper Die Attachment for Power Electronics Packaging
3个月前
已完结
In-situ generated Cu nanoclusters enable cluster-mediated interfacial diffusion during pressure-assisted Cu sinter bonding
3个月前
已完结
Oxidation-resistant bimodal copper interconnects on LCP substrates via in-situ chemically-assisted nano-soldering
3个月前
已完结
Air-sinterable copper pastes for next-generation electronics: a review
4个月前
已完结
High-Concentration Synthesis of Sub-10-nm Copper Nanoparticles for Application to Conductive Nanoinks
4个月前
已完结
Rapid low temperature sintering in air of copper submicron particles with synergistic surface-activation and anti-oxidative protection
4个月前
已完结
Fabrication of Conductive Copper Films on Flexible Polymer Substrates by Low-Temperature Sintering of Composite Cu Ink in Air
4个月前
已完结
A molecular pathway to corrosion-resistant printable copper
4个月前
已完结
Self-reducible copper complex inks with aminediol and OH-based solvent for the fabrication of a highly conductive copper film by calcination at low temperature under an air atmosphere
5个月前
已完结
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