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段青枫
Lv4
510 积分
2021-09-10 加入
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Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps
1个月前
已完结
Structure of low dielectric constant to extreme low dielectric constant SiCOH films: Fourier transform infrared spectroscopy characterization
1个月前
已完结
Porous pSiCOH Ultralow-k Dielectrics for Chip Interconnects Prepared by PECVD
1个月前
已完结
Ultralow k using a plasma enhanced chemical vapor deposition porogen approach: Matrix structure and porogen loading influences
1个月前
已完结
Plasma-enhanced chemical vapor deposition of low-k dielectric films using methylsilane, dimethylsilane, and trimethylsilane precursors
1个月前
已完结
Development of PECVD SiC for MEMS Using 3MS as the Precursor
1个月前
已完结
Optimized Materials Properties for Organosilicate Glasses Produced by Plasma-Enhanced Chemical Vapor Deposition
1个月前
已完结
Nutritional and clinical factors associated with acute kidney injury development in critically ill children
2个月前
已完结
Accuracy of analytical expressions for solar cell fill factors
3个月前
已完结
Technical and economic prospects of fuel cells combination with polygeneration systems?
7个月前
已完结
Endothelium-specific depletion of LRP1 improves glucose homeostasis through inducing osteocalcin
2年前
已采纳
Incomplete Multi-View Clustering with Reconstructed Views
2年前
已采纳
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2年前
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