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20 积分 2024-11-28 加入
Influence of Process Parameters on Surface Activated Aluminum-to-Aluminum Wafer Bonding
4小时前
待确认
Direct Al–Al contact using low temperature wafer bonding for integrating MEMS and CMOS devices
4小时前
已完结
Investigations of silicon wafer bonding utilizing sputtered Al and Sn films
15天前
已完结
Localized induction heating solder bonding for wafer level MEMS packaging
17天前
已完结
Bonding silicon wafers with reactive multilayer foils
18天前
已完结
Joining of alumina ceramics using silicon–magnesium composite filler for high-temperature applications
20天前
已完结
Effect of bonding time on microstructure and mechanical properties of diffusion brazed IN-939
20天前
已完结
Ultrafast Laser Welding of Silicon
1个月前
已完结
Numerical study of thermal stress during different stages of silicon Czochralski crystal growth
1个月前
已完结
Thermal stress analysis of silicon bulk single crystal during Czochralski growth
1个月前
已完结
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