Lv4
680 积分 2020-10-05 加入
High peel strength and excellent solder heat‐resistance epoxy adhesive for flexible copper clad laminate
4个月前
已完结
Synthesis of High Tg and Low CTE Polyimides From Acridinone Diamines With Various Linearity
8个月前
已完结
Polyimides with super-high Tg and ultra-low coefficient of thermal expansion from N-substituted bibenzimidazole diamines
9个月前
已完结
Selective Co2+ recovery using MgNa3H(PO4)2 adsorbent from water
10个月前
已完结
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