Lv41
510 积分 2020-10-05 加入
High peel strength and excellent solder heat‐resistance epoxy adhesive for flexible copper clad laminate
13天前
已完结
Synthesis of High Tg and Low CTE Polyimides From Acridinone Diamines With Various Linearity
3个月前
已完结
Polyimides with super-high Tg and ultra-low coefficient of thermal expansion from N-substituted bibenzimidazole diamines
5个月前
已完结
Selective Co2+ recovery using MgNa3H(PO4)2 adsorbent from water
5个月前
已完结
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