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10 积分 2025-07-14 加入
Numerical study of the effect of epoxy molding compound gradation on the thermo-mechanical properties of package
2个月前
已完结
Chemistry and Types of Epoxy Resins
2个月前
已完结
Flame Temperature Distribution and SiO2 Particles Distribution in Oxyhydrogen Flame
4个月前
已完结
The Effects of Particle Size-Matching Filling of Spherical Silica on the Flowability of Epoxy Molding Compounds for Large-Scale Integrated Circuits Packaging
4个月前
已完结
Enhanced Thermal and Mechanical Properties of Epoxy Composites by Spherical Silica with Different Size
4个月前
已完结
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