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10 积分 2025-07-14 加入
Numerical study of the effect of epoxy molding compound gradation on the thermo-mechanical properties of package
3小时前
已完结
Chemistry and Types of Epoxy Resins
5天前
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Flame Temperature Distribution and SiO2 Particles Distribution in Oxyhydrogen Flame
2个月前
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The Effects of Particle Size-Matching Filling of Spherical Silica on the Flowability of Epoxy Molding Compounds for Large-Scale Integrated Circuits Packaging
2个月前
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Enhanced Thermal and Mechanical Properties of Epoxy Composites by Spherical Silica with Different Size
2个月前
已完结
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