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8 积分 2026-03-02 加入
Thermal management materials for 3D-stacked integrated circuits
1个月前
已完结
Direct preparation of diamond heat dissipation microchannel assemblies by picosecond laser
1个月前
已完结
Structural changes during femtosecond laser percussion drilling of high-aspect-ratio diamond microholes
3个月前
已完结
Structural and thermal analysis of polycrystalline diamond thin film grown on GaN-on-SiC with an interlayer of 20 nm PECVD-SiN
4个月前
已完结
Interplay between morphology and thickness of a SiN interlayer for enhanced thermal transport across the GaN/diamond interface
4个月前
已完结
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