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512 积分 2024-07-27 加入
Interfacial thermal transport in Si/SiC and SiC/diamond heterostructures: effects of amorphous interlayers and SiC polytypes
3个月前
已完结
Building 3D “point-plane” thermal conduction networks with in-situ fabricated graphitic carbon nitride@nanodiamond heterostructures for highly thermally conductive epoxy composites
3个月前
已完结
Building 3D “point-plane” thermal conduction networks with in-situ fabricated graphitic carbon nitride@nanodiamond heterostructures for highly thermally conductive epoxy composites
3个月前
已完结
Interfacial thermal transport in Si/SiC and SiC/diamond heterostructures: effects of amorphous interlayers and SiC polytypes
3个月前
已完结
Binary hybrid filler composite formulations of surface modified Fe–Si–Al alloys for multifunctional EMI shielding and thermal conduction
4个月前
已完结
Excellent thermal conductive epoxy composites via adding UHMWPE fiber obtained by hot drawing method
4个月前
已完结
Fabrication of high-thermal-conductivity and low-dielectric boron Nitride/Quartz Fiber/Epoxy composites
4个月前
已完结
Boron nitride nanosheet @ quantum‐sized diamond nanocrystal complex/epoxy nanocomposites with enhancing thermal conductivity and sufficient dielectric breakdown strength
4个月前
已完结
Enhanced thermal conductivity of epoxy composites by introducing graphene@boron nitride nanosheets hybrid nanoparticles
4个月前
已完结
Binary hybrid filler composite formulations of surface modified Fe–Si–Al alloys for multifunctional EMI shielding and thermal conduction
4个月前
已完结
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