Lv1
10 积分 2024-05-21 加入
Recent progress in polymer/two-dimensional nanosheets composites with novel performances
13天前
已完结
A review of the thermal conductivity of silver-epoxy nanocomposites as encapsulation material for packaging applications
13天前
已完结
Advances on Thermally Conductive Epoxy‐Based Composites as Electronic Packaging Underfill Materials—A Review
13天前
已完结
Low dielectric post-cured benzocyclobutene-functionalized fluorine-containing polyimide material
13天前
已完结
Enhanced electromagnetic wave absorption, thermal conductivity and flame retardancy of BCN@LDH/EP for advanced electronic packing materials
13天前
已完结
皖公网安备34019202002308
