Lv11
20 积分 2024-01-02 加入
Facile Fabrication of Epoxy Resin Composites via Polymer Blending Modification and Its Applications in Solar Cell
3小时前
已完结
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics
22天前
已完结
Molecular dynamics simulation of copper paste sintering for chip interconnection
22天前
已完结
All-Solution-Processed Metallization of High Aspect Ratio Through Glass Vias (HAR-TGVs) with a High Adhesion Promoting Layer (APL)
25天前
已完结
Effective Thermal Conductivity of Composites with Interfacial Thermal Contact Resistance
1个月前
已完结
Tunable molecular dipole moments and orientations for efficient and stable perovskite solar cells
2个月前
已完结
Impact of trimodal copper powder mixing on copper-sintered joints for power semiconductor packaging
5个月前
已关闭
Recent advances in improvement of thermal conductivity of epoxy-based nanocomposites through addition of fillers
10个月前
已完结
Special finite elements with arbitrarily-shaped holes for heat conduction analysis of porous materials
10个月前
已关闭
Silver–Copper Alloy Nanoinks for Ambient Temperature Sintering
11个月前
已完结
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