Lv11
40 积分 2024-01-02 加入
Review of Die-Attach Materials for SiC High-Temperature Packaging
5小时前
已完结
Graphene Paper‐Based Multilayer Thermally Conductive Tapes with Exceptional Electrical Insulation for High Heat Flux Dissipation
1个月前
已完结
High thermal conductivity copper/graphene composites for efficient thermal management
1个月前
已完结
Neodymium‐Modified Molybdenum Blue Nanoclusters Alleviate Polycystic Ovary Syndrome via Radical Scavenging
2个月前
已完结
Regulated Interfacial Thermal Conductance between Cu and Diamond by a TiC Interlayer for Thermal Management Applications
2个月前
已完结
Materials for high-temperature digital electronics
3个月前
已完结
Exploring modeling and testing approaches for three-dimensional integrated thermal resistance of chiplets
3个月前
已完结
A New Approach for Sintering Simulation of Irregularly Shaped Powder Particles
4个月前
已完结
Facile Fabrication of Epoxy Resin Composites via Polymer Blending Modification and Its Applications in Solar Cell
4个月前
已完结
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics
5个月前
已完结
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