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90 积分 2025-06-28 加入
Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging
3个月前
已完结
Phase change materials for thermal management and energy storage: A review
4个月前
已完结
Thermally conductive and electrically insulative alumina/epoxy composites for advanced electronic packaging applications: A comprehensive review of filler morphologies and surface modifications
4个月前
已完结
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