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200 积分 2025-06-28 加入
Towards electrical insulation electromagnetic interference shielding materials: a magnetic network–microcapacitor framework for advanced electronic packaging
4个月前
已完结
Hydroxyl‐Terminated Polyphenylene Oxide Improved Thermal and Dielectric Properties of Active Ester Cured SiO2/Epoxy Composites for Advanced Electronic Packaging
7个月前
已完结
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