Lv1
60 积分 2025-08-25 加入
Modeling and experimentation of creep-fatigue and failure of low-profile quad flat package under thermal cycle
27天前
已完结
Neural Network Assisted Speed Up of High Fidelity Warpage Simulations towards Design for Reliability in Ultra-Thin Packages
29天前
已完结
Effects of Warpage on Fatigue Reliability of Solder Bumps: Experimental and Analytical Studies
1个月前
已完结
In‐Chip Mechanical Reliability Characterization and Modeling of CMOS‐Based Memristor for 3D Integration
2个月前
已完结
数字图像相关装置的准确度和精度检验方法
3个月前
已完结
Effects of Temperature on Prepreg & Glass Style in Printed Circuit Board (PCB) - Impact on Solid State Drive
7个月前
已完结
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