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Cu–Cu low-temperature diffusion bonding by spark plasma sintering: Void closure mechanism and mechanical properties
1天前
已完结
Vacuum diffusion bonding of TC4 titanium alloy and T2 copper by a slow cooling heat treatment
1天前
已完结
Microstructure and mechanical properties of vacuum electron beam welded joints of Ti/Cu dissimilar metals
1天前
已完结
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