Lv23
190 积分 2026-04-26 加入
Synergetic Effect of Chemical Components in a Tungsten CMP Slurry and the Evolution of Tungsten Surface Species
9天前
已完结
A review on chemical and mechanical phenomena at the wafer interface during chemical mechanical planarization
9天前
已完结
Study on Amino Acid Corrosion Inhibitors in Tungsten Chemical Mechanical Planarization
9天前
已完结
Synthesis, Characterization and Properties of N‐Alkyl‐N,N‐di(2‐hydroxyethyl) Amine Oxides
14天前
已完结
Effect of 2-phosphonobutane-1,2,4-tricarboxylic acid (PBTCA) on Cu/Ta chemical mechanical planarization (CMP) in the barrier layer: A novel complexing agent and the dual role on Cu
15天前
已完结
A well-defined thermo- and pH-responsive double hydrophilic graft copolymer bearing pyridine-containing backbone
15天前
已完结
Study on Amino Acid Corrosion Inhibitors in Tungsten Chemical Mechanical Planarization
16天前
已完结
Predictive modeling of mixed abrasive slurry for enhanced performance in tungsten chemical mechanical polishing: A particle number concentration approach
19天前
已完结
Origins of wear-induced tungsten corrosion defects in semiconductor manufacturing during tungsten chemical mechanical polishing
20天前
已完结
Tungsten passivation layer (WO3) formation mechanisms during chemical mechanical planarization in the presence of oxidizers
20天前
已完结
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