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Structural design and optimization of planar micro thermoelectric temperature controller used for AWG chips
2小时前
待确认
Effect of solder junction void variation in power semiconductor package on power cycle lifetime
26天前
已完结
Nanometer‐Scale Modification and Welding of Silicon and Metallic Nanowires with a High‐Intensity Electron Beam
9个月前
已完结
Research on Steady-State Thermal Impedance Calculation and Junction Temperature Prediction of Welded IGBT
9个月前
已完结
Characterizations of a Proposed 3300-V Press-Pack IGBT Module Using Nanosilver Paste for High-Voltage Applications
10个月前
已完结
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