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370 积分 2024-10-24 加入
Fusing-smashing exfoliation for high-aspect-ratio hexagonal boron nitride nanosheets available to highly-thermoconductive polymeric composites
20天前
已完结
All-printed VIA-free polyimide-based multilayer flexible circuits
20天前
已完结
In-situ growth of CuS on polyimide film to construct dense and continuous network: Achieving excellent electrothermal and EMI shielding performance
21天前
已完结
A novel composite film with superhydrophobic graphene for anti-icing/deicing via chemical-assisted magnetically controllable picosecond laser writing
21天前
已完结
Phonon‐Bridge Engineering in Vertically Aligned Graphene Paper Composites Enables Efficient and Reliable Thermal Interface Materials
21天前
已完结
Moisture-stable aluminum nitride via conformal Parylene passivation for reliable high-performance thermal interface materials
21天前
已关闭
Mechanisms of reactive medium-assisted laser ablation of thermally active materials: a case study of hydrochloric film-assisted laser machining of microchannel arrays on AlN
21天前
已完结
Study of using enhanced heat-transfer flexible phase change material film in thermal management of compact electronic device
21天前
已完结
Highly efficient bio-inspired manifold microchannel cooling for steady-state and transient thermal management of high-power chips
21天前
已完结
Thermal management enhancement of electronic chips based on novel technologies
21天前
已完结
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