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100 积分 2023-10-25 加入
Side Wall Wetting Induced Void Formation due to Small Solder Volume in Microbumps of Ni/SnAg/Ni upon Reflow
1个月前
已完结
Formation Mechanism of Novel Sidewall Intermetallic Compounds in Micron Level Sn/Ni/Cu Bumps
1个月前
已完结
Kinetics of interfacial reaction in bimetallic CuSn thin films
1个月前
已完结
Crosslinking modification and hydrogen bonding synergy to achieve high breakdown strength and energy density of PMMA-co-GMA/PVDF dielectric composite films
9个月前
已完结
Highly Transparent PVDF Films with Enhanced Dielectric and Energy Storage Properties Tailored by a PMMA-co-GMA Copolymer
9个月前
已完结
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