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78 积分 2022-11-04 加入
Nano-copper sintering technology for packaging of silicon carbide power devices: Recent advances in anti-oxidation strategies, low-temperature interconnection mechanisms, and reliability
1个月前
已完结
Commercialization and Cost-Optimization of a Hybrid Si/SiC EV Traction Inverter
3个月前
已完结
Electrochemical Migration of Fine-Pitch Nanopaste Ag Interconnects
4个月前
已完结
Reducing Migration of Sintered Ag for Power Devices Operating at High Temperature
4个月前
已完结
Electrochemical migration of tin in electronics and microstructure of the dendrites
4个月前
已完结
Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics
4个月前
已完结
Evaluating electrochemical migration behavior of sintered nano-Ag: factors of bias voltage, electrode spacing, sinter process parameters, and NaCl concentration
4个月前
已完结
Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits
7个月前
已完结
Influence of Molding Compound on Leakage Current in MOS Transistors
7个月前
已完结
Leakage Current Mechanisms in Silicon Carbide MOSFETs - A Review
7个月前
已完结
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