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80 积分 2022-11-04 加入
Electrochemical Migration of Fine-Pitch Nanopaste Ag Interconnects
27天前
已完结
Reducing Migration of Sintered Ag for Power Devices Operating at High Temperature
27天前
已完结
Electrochemical migration of tin in electronics and microstructure of the dendrites
27天前
已完结
Microstructure and elemental composition of electrochemically formed dendrites on lead-free micro-alloyed low Ag solder alloys used in electronics
27天前
已完结
Evaluating electrochemical migration behavior of sintered nano-Ag: factors of bias voltage, electrode spacing, sinter process parameters, and NaCl concentration
28天前
已完结
Leakage current mechanisms and leakage reduction techniques in deep-submicrometer CMOS circuits
4个月前
已完结
Influence of Molding Compound on Leakage Current in MOS Transistors
4个月前
已完结
Leakage Current Mechanisms in Silicon Carbide MOSFETs - A Review
4个月前
已完结
Physico-chemical characterization of polyimide passivation layers for high power electronics applications
4个月前
已完结
Improved package reliability of AlGaN/GaN HFETs on 150 mm Si substrates by SiNx/polyimide dual passivation layers
4个月前
已完结
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