Lv2
116 积分 2021-09-06 加入
0.5 μm Pitch Wafer-to-wafer Hybrid Bonding at Low Temperatures with SiCN Bond Layer
3个月前
已完结
Hybrid Bonding Interconnect for Advanced Heterogeneously Integrated Processors
3个月前
已完结
Wafer to Wafer Hybrid Bonding for DRAM Applications
4个月前
已完结
Cu and barrier CMP process development with fine 1μm Cu bond pad and 2.5 μm pitch for Wafer-to-wafer Hybrid Bonding
4个月前
已完结
Mechanism and Applications of Chemical and Mechanical Polishing
4个月前
已完结
Lubricating properties of ester oil prepared from bio-based 2,5-furandicarboxylic acid
5个月前
已完结
Fracturing Fluid Polymer Thickener with Superior Temperature, Salt and Shear Resistance Properties from the Synergistic Effect of Double-Tail Hydrophobic Monomer and Nonionic Polymerizable Surfactant
6个月前
已完结
Synthesis of super high molecular weight copolymer of AM/NaA/AMPS by oxidation–reduction and controlled radical polymerization
6个月前
已完结
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