Lv4
506 积分 2025-11-16 加入
Multi-Physics Simulations of a 1.2 kV Embedded SiC Prepackage
10小时前
已完结
Warpage Prediction for Direct-Cooling SiC Power Module-Heat Sink Assemblies with Sintered Nanosilver Joints in Electric Vehicles
30天前
已完结
Sintered Silver-Based Direct-Cooled IGBTs With High Output Power and Thermal Reliability
30天前
已完结
Comparative Analysis of Degradation of SiC MOSFET Power Module With Different Proportions of Al/Cu Buffer Under Power Cycling
1个月前
已关闭
Copper-Wire Stress Buffers for Extending Lifetime of Double-Sided Bidirectional SiC Modules
1个月前
已完结
Reliable Aluminum Wire-Bonded SiC/Si Diodes With Laminated Al/Cu Stress Buffers
1个月前
已完结
Design and Thermal Optimization of a PCB-Embedded SiC Half-Bridge Power Module
1个月前
已完结
Mechanics-Based Sequential Fabrication Model of Glass-Core Packages with Embedded Chiplets in Redistribution Layers
1个月前
已完结
Embedded High-Power RF Chips in Glass Core Package
1个月前
已完结
皖公网安备34019202002308
