Lv41
526 积分 2025-11-16 加入
Numerical study of the thermomechanical response of printed circuit boards with embedded flip-chips
1小时前
已完结
A Low-Parasitic-Inductance Double-Sided Cooling Silicon Carbide Power Module Featuring 3D Mutual Inductance Cancellation
20天前
已完结
Design and Analysis of PCB Embedded SiC Half-Bridge Packaging Cells With Low Thermal Resistance and Parasitic Inductance
26天前
已完结
A Wire-Free PCB Plus DBC Hybrid SiC MOSFET Power Module With Ultra-Low Parasitic Inductance and Integrated PCB Microtube Cooling
1个月前
已完结
Multi-Physics Simulations of a 1.2 kV Embedded SiC Prepackage
1个月前
已完结
Warpage Prediction for Direct-Cooling SiC Power Module-Heat Sink Assemblies with Sintered Nanosilver Joints in Electric Vehicles
2个月前
已完结
Sintered Silver-Based Direct-Cooled IGBTs With High Output Power and Thermal Reliability
2个月前
已完结
Comparative Analysis of Degradation of SiC MOSFET Power Module With Different Proportions of Al/Cu Buffer Under Power Cycling
2个月前
已关闭
Copper-Wire Stress Buffers for Extending Lifetime of Double-Sided Bidirectional SiC Modules
2个月前
已完结
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