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High-Hardness High-Thermal-Conductivity Diamond/SiC Composite Consolidated by Spark Plasma Sintering
17天前
已完结
Thermal transport properties and densification mechanism of bimodal diamond/SiC composites by spark plasma sintering
21天前
已关闭
Near-junction heat dissipation of high-power chips by copper-diamond based heat sink
7个月前
已完结