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250 积分 2025-06-12 加入
Performance transformation of Co-added Sn58Bi solder joints under thermal shock conditions for interconnection packaging
1个月前
已完结
Optimization of the electrodeposition process of Sn bi eutectic alloy in a methanesulfonic acid system
4个月前
已完结
Constituents and performance of no-clean flux for electronic solder
6个月前
已关闭
Formability behavior of Al/steel MIG arc brazed-fusion welded joint
7个月前
已完结
Influence of laser offset on laser welding-brazing of Al/brass dissimilar alloys
7个月前
已完结
Effect of horizontal magnetic field on the microstructure and mechanical properties of Ti nanoparticles-reinforced Sn1.0Ag0.5Cu solder: experimental and first-principles calculations
9个月前
已完结
Microstructure and properties of tungsten heavy alloys reinforced with ZrO2 particles by spark plasma sintering
10个月前
已完结
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