Lv21
170 积分 2020-10-24 加入
Performance analysis and yield estimation for a negative capacitance field effect transistor-based eight-transistor static random access memory
7小时前
待确认
Three-dimensional hybrid bonding integration challenges and solutions toward multi-wafer stacking
6个月前
已完结
A Novel Approach for Cooling Chiplets in Heterogeneously Integrated 2.5-D Packages Applying Microchannel Heatsink Embedded in the Interposer
8个月前
已完结
Die to Wafer Hybrid Bonding for Chiplet and Heterogeneous Integration: Die Size Effects Evaluation-Small Die Applications
1年前
已完结
3D process simulation-assisted device failure analysis with virtual defect injection in IC layout
1年前
已完结
A new accurate yield prediction method for system-LSI embedded memories
1年前
已完结
An On-Chip Self-Powered Non-Volatile One-Time-Programmable Memory System in Standard CMOS Technology
1年前
已关闭
TSV process optimization for reduced device impact on 28nm CMOS
2年前
已关闭
The study of TSV-induced and strained silicon-enhanced stress in 3D-ICs
2年前
已完结
Heterogeneous Integration of Chiplets: Cost and Yield Tradeoff Analysis
2年前
已完结
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