Lv2
160 积分 2022-10-08 加入
Enhancement of pressure-free bonding with Cu particles by the addition of Cu-Ni alloy nanoparticles
21天前
已完结
Preparation of ultra fine nickel–copper bimetallic powder for BME-MLCC
1个月前
已完结
Termination of BME-MLCC using copper-nickel bimetallic powder as electrode material
1个月前
已完结
The Effect of Multiple Solder Reflows on the Formation of Cu6Sn5 Intermetallics and the Decomposition of SnAg3.0Cu0.5 Solder Joints in the Framework of Rework and Reuse of MLCC Components
1个月前
已完结
Low-temperature sintering Cu-Ag terminal electrodes for MLCCs
1个月前
已完结
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