Lv11
6 积分 2024-11-05 加入
Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling
6小时前
已完结
Location of Seismic Signals Associated with Microearthquakes and Rockfalls on the Séchilienne Landslide, French Alps
14天前
已完结
Reliability Simulation and Life Prediction of Sn63Pb37 BGA Solder Joint Under Thermal Cycling Load
19天前
已完结
Thermal fatigue reliability analysis of PBGA with Sn63Pb37 solder joints
19天前
已完结
Finite element method and experimental study on life prediction of lead-free BGA solder joints using an energy-based approach
21天前
已完结
Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling
21天前
已完结
A NON-LINEAR CONTINUOUS FATIGUE DAMAGE MODEL
1个月前
已完结
Study on Using Noisy Synthetic Data for Neural Networks to Assess Thermo-Mechanical Reliability Parameters of Solder Interconnects
1个月前
已完结
Predicting the Life of the Solder Joints in Electronic Assemblies using Physics-informed Data-driven Methodology
1个月前
已完结
Data Augmentation Using GANs
1个月前
已完结
皖公网安备34019202002308
