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2110 积分 2022-11-25 加入
Power Ultrasound in Electrochemistry: From Versatile Laboratory Tool to Engineering Solution
15小时前
待确认
Enhancement of micro hole wetting and hydrogen bubble release in the process of Ni micro electroforming under megasonic field
24天前
已完结
Electroplating of Fe-Rich NiFe Alloys in Sub-50 nm Lines
26天前
已完结
Grain refining in copper foil induced by ultrasonic field during the electrodeposition process
26天前
已完结
High-speed and high-quality TSV filling with the direct ultrasonic agitation for copper electrodeposition
1个月前
已完结
Copper electroplating of PCB interconnects using megasonic acoustic streaming
1个月前
已完结
Megasonic agitation for enhanced electrodeposition of copper
1个月前
已完结
Dynamics of filling process of through silicon via under the ultrasonic agitation on the electroplating solution
1个月前
已完结
Copper electroplating of PCB interconnects using megasonic acoustic streaming
1个月前
已完结
Numerical simulation of the copper electroplating of TSV with additives under megasound effect
1个月前
已完结
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