Lv3
230 积分 2024-12-18 加入
Etch Characteristics of TiO2 Etched by Using an Atomic Layer Etching technique with BCl3 Gas and an Ar Neutral Beam
5天前
已关闭
On the Etching Mechanism of Highly Hydrogenated SiN Films by CF4/D2 Plasma: Comparison with CF4/H2
1个月前
已完结
In situ dry cleaning of Si wafer using OF2/NH3 remote plasma with low global warming potential
1个月前
已完结
Low-temperature etching of silicon oxide and silicon nitride with hydrogen fluoride
1个月前
已完结
High-aspect-ratio amorphous carbon mask etch profile control through plasma and surface chemistry optimization
2个月前
已完结
Surface sulfurization of amorphous carbon films in the chemistry of oxygen plasma added with SO2 or OCS for high-aspect-ratio etching
2个月前
已完结
Etching, Cutting, Drilling
4个月前
已关闭
Dopant-dependent Ion Assisted Etching Kinetics in Highly Doped Polysilicon Reactive Ion Etching
4个月前
已完结
Challenge of Boron-Doped Silicon Hard Mask Removal
4个月前
已完结
SiO2and Si3N4etch mechanisms in NF3/hydrocarbon plasma
4个月前
已完结
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