Lv5
1210 积分 2020-11-09 加入
A Novel Indium Metal Thermal Interface Material and Package Design Configuration to Enhance High-Power Advanced Si Packages Thermal Performance
7个月前
已完结
Power Delivery for High-Performance Microprocessors—Challenges, Solutions, and Future Trends
11个月前
已完结
Integrated Deep Trench Capacitor in Si Interposer for CoWoS Heterogeneous Integration
11个月前
已完结
3D Microelectronic Packaging
1年前
已完结
DTCO Launches Moore’s Law Over the Feature Scaling Wall
1年前
已完结
Next-Generation Design and Technology Co-optimization (DTCO) of System on Integrated Chip (SoIC) for Mobile and HPC Applications
1年前
已完结
(Invited) A Comparison of Device Architecture, Electrical Performance and Process Flow between FinFET and Planar MOSFETs
1年前
已完结
Directed self-assembly of block copolymers for 7 nanometre FinFET technology and beyond
1年前
已完结
Interconnect Design-Technology Co-Optimization for Sub-3nm Technology Nodes
1年前
已完结
Monolithic 3D Semiconductor Footprint Scaling Exploration Based on VFET Standard Cell Layout Methodology, Design Flow, and EDA Platform
1年前
已完结
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