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10 积分 2024-09-19 加入
A comparison of typical additives for copper electroplating based on theoretical computation
3天前
已完结
Fast Filling of Microvia by Pre-Settling Particles and Following Cu Electroplating
3天前
已完结
Crystal growth patterns in DC and pulsed plated galvanic copper films on (1 1 1), (1 0 0) and (1 1 0) copper surfaces
3天前
已完结
Bulk superconductivity up to 96 K in pressurized nickelate single crystals
4个月前
已完结
Abnormal Cu Grain Growth by External Stress on Electroplated Cu Films
8个月前
已完结
Depth-dependent self-annealing behavior of electroplated Cu
8个月前
已完结
Scaling analysis of current influence on Hastelloy surface roughness in electro-polishing process
8个月前
已完结
Continuous electropolishing technique for long-length Hastelloy C-276 tape
8个月前
已完结
Current Status of High Temperature Superconducting Materials and their Various Applications
8个月前
已完结
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