Lv41
610 积分 2024-07-29 加入
The effect of inlet/outlet number and arrangement on hydrothermal behavior and entropy generation of the laminar water flow in a pin-fin heat sink
2小时前
待确认
Study on the performance of wavy microchannel heat sink with staggered inlets and outlets
2小时前
待确认
Efficient layout design automation for multi‐chip SiC modules targeting small footprint and low parasitic
16天前
已完结
Research on Thermal-Decoupling Method for Chips in Press-Pack IGBT Package
17天前
已完结
Influence of chip layout on temperature distribution of multi-chip press pack IGBT devices
17天前
已完结
Design and intelligent optimization of TSV-based embedded microchannel heatsinks in 2.5D Packaging
17天前
已完结
A review on thermal management of light-emitting diodes: From package-level to system-level
1个月前
已完结
Boiling heat transfer characteristics of distributed jet array impingement on metal foam-covered surface
1个月前
已完结
Cooling performance in a minichannel heat sink with different triangular pin-fins configurations
1个月前
已完结
Thermal management of Electronics: Numerical investigation of triangular finned heat sink
1个月前
已完结
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