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650 积分 2024-07-29 加入
Thermo-hydraulic performance analysis of multi-layer porous fin microchannels
3个月前
已完结
Performance evaluation and experimental verification of optimizing fin angles in adjustable- configuration heat sinks
4个月前
已完结
Numerical investigation on the temperature uniformity of micro-pin-fin heat sinks with variable density arrangement
4个月前
已完结
The effect of inlet/outlet number and arrangement on hydrothermal behavior and entropy generation of the laminar water flow in a pin-fin heat sink
4个月前
已完结
Study on the performance of wavy microchannel heat sink with staggered inlets and outlets
4个月前
已完结
Efficient layout design automation for multi‐chip SiC modules targeting small footprint and low parasitic
4个月前
已完结
Research on Thermal-Decoupling Method for Chips in Press-Pack IGBT Package
4个月前
已完结
Influence of chip layout on temperature distribution of multi-chip press pack IGBT devices
4个月前
已完结
Design and intelligent optimization of TSV-based embedded microchannel heatsinks in 2.5D Packaging
4个月前
已完结
A review on thermal management of light-emitting diodes: From package-level to system-level
5个月前
已完结
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