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Numerical and Mechanical Analysis of Direct Wafer Bonding Considering Non-Uniform Impurity Particle Distributions
3小时前
已完结
Mechanical modeling and analysis of direct wafer bonding technology considering the effect of impurity particles
3小时前
已完结
Overlay performance in permanent bonded wafer integration schemes
2天前
已完结
Study and Control of the Distortion Induced by the Bonding Process for BSPDN Approaches
2天前
已完结
Bond Wave Analysis of SiCN for Fine Pitch Hybrid Bonding
2天前
已完结
A wafer-shape based model for predicting in-plane distortion
10天前
已完结
Integration, Materials and Equipment Innovations to Enable 100 nm Pitch W2W Bonding for Memory-to-Logic and Logic-to-Logic 3D Stacking
12天前
已完结
Investigation of Post-Bond Distortion in Direct Wafer Bonding
13天前
已完结
Stress reduction and wafer bow accommodation for the fabrication of thin film lithium niobate on oxidized silicon
13天前
已完结
Mechanical modeling and analysis of direct wafer bonding technology considering the effect of impurity particles
13天前
已完结
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