Lv5
1300 积分 2025-06-30 加入
High-Resolution Printing of Redistribution Layers for Fan-Out Wafer-Level Packaging by using Ultra-Precise Micro-deposition Technology
11小时前
已完结
Direct-Write 3D Printing of Interconnects for Fan-Out Wafer-Level Packaging
11小时前
已完结
25.2 A 16Gb Sub-1V 7.14Gb/s/pin LPDDR5 SDRAM Applying a Mosaic Architecture with a Short-Feedback 1-Tap DFE, an FSS Bus with Low-Level Swing and an Adaptively Controlled Body Biasing in a 3rd-Generation 10nm DRAM
11天前
已完结
HiFi-DRAM: Enabling High-fidelity DRAM Research by Uncovering Sense Amplifiers with IC Imaging
11天前
已完结
An 8.5-Gb/s/Pin 12-Gb LPDDR5 SDRAM With a Hybrid-Bank Architecture, Low Power, and Speed-Boosting Techniques
11天前
已完结
13.8 A 1a-nm 1.05V 10.5Gb/s/pin 16Gb LPDDR5 Turbo DRAM with WCK Correction Strategy, a Voltage-Offset-Calibrated Receiver and Parasitic Capacitance Reduction
12天前
已完结
Signal Integrity Optimization of LPDDR5X Memory Interface Operating at 9.6 Gbps
12天前
已完结
Study on the PKG Design of LPDDR5 for Low EMI Characteristic
12天前
已完结
Multiple-Wafer (9-Layer), Extreme Thin ($3 \mu ~\mathrm{m}$-Si per Stack) and Innovative Fusion-Bonded Via-In-One Architecture for High Bandwidth 3D Memory
12天前
已完结
Challenges and Innovations in High-Bandwidth DRAM: The Case for Z Angle Memory
12天前
已完结
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