Lv41
670 积分 2025-06-30 加入
A 3D Stackable 1T1C DRAM: Architecture, Process Integration and Circuit Simulation
2天前
已完结
Exploring Innovative IGZO-channel based DRAM Cell Architectures and Key Technologies for Sub-10nm Node
3天前
已完结
A Comparative Study of HBL and VBL 3D DRAM: Signal Margin, Bit-cell Density, and Scalability
3天前
已完结
Novel Three-Dimensional DRAM Cell Architectures with IGZO-Channel and Key Technologies Toward Sub-10nm and Beyond
3天前
已完结
Thermal Analysis of DDR5 DIMM with Forced Air Cooling Method
4天前
已完结
Integration of High-k Metal Gate (HKMG) to Core/Peri Transistors of DRAM Addressing Reliability Issues
12天前
已完结
Receiver Characterization with On-Die Eye Monitor (ODEM) in LPDDR5 and DDR5 SDRAM
1个月前
已完结
A comparative study of conventional solder bump and copper pillar bump in flip chip technology using computational fluid dynamics
2个月前
已关闭
A 16-Gb T-Coil-Based GDDR6 DRAM With Merged-MUX TX, Optimized WCK Operation, and Alternative-Data-Bus Achieving 27-Gb/s/Pin in NRZ
2个月前
已完结
Open/folded bit-line arrangement for ultra-high-density DRAM's
2个月前
已完结
皖公网安备34019202002308
