Lv5
1580 积分 2025-06-30 加入
Principles of Power Integrity for PDN Design:
2小时前
已完结
Low-temperature photo imageable dielectric for redistribution layers in advanced packaging application
1个月前
已完结
Redistribution Layer Routing for Fan-Out Wafer-Level Packaging Considering Multiple Advanced Design Rules
1个月前
已完结
LPDDR5 (6.4 Gbps) 1-tap DFE Optimal Weight Determination
1个月前
已完结
Optimization of Flip-Chip Reflow Soldering Process and Thermal Stress Study of 2D Digital SiP with High-Density BGA Chip
1个月前
已完结
A 1cnm 14.4Gb/s/pin 16Gb LPDDR6 SDRAM with Efficiency Mode, LDO-Based WCK Tree, Dynamic Write NT-ODT, Fast CS Control and System Meta Mode
1个月前
已完结
A 16Gb 12.8Gb/s LPDDR6 SDRAM with 12-DQ/Sub-Channel Wide NRZ Signaling and Enhanced Reliability by Per-Row Activation Counting and Meta-Data Scheme
1个月前
已完结
Performance and Power Analysis of LPDDR6
1个月前
已完结
SPICE based SI-PI co-simulation Framework to optimize Die-Package-PCB to meet LPDDR5(x) Performance in Automotive and Edge MPU-MCU
1个月前
已完结
Novel Photosensitive Material with Low Shrinkage and Low Dielectric properties for High-Density RDL in Glass Packaging
2个月前
已完结
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