Lv3
210 积分 2022-10-19 加入
Nondeterministic Mobility based Incentive Mechanism for Efficient Data Collection in Crowdsensing
5个月前
已完结
An optimized Ni P seed layer coating method for through glass via (TGV)
6个月前
已完结
Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review
6个月前
已完结
Micron- and nano-sized copper sintering pastes: Materials, processes, and applications
6个月前
已完结
Warpage Optimization of Package Substrates Using Metamodels - A Review
6个月前
已完结
A Study on Glass Surface Activation Process to Enhance Glass-Metal Adhesion Strength in Glass Advanced Packaging
8个月前
已完结
First Demonstration of Panel Glass Fan-Out (GFO) Packages for High I/O Density and High Frequency Multi-chip Integration
8个月前
已完结
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