Lv21
158 积分 2022-12-13 加入
Parasitic Extraction and Signal Integrity Analysis of Memristor-Based Crossbar Arrays for Neuromorphic Computing
3小时前
待确认
Packaging and Integration of Multifunctional Brain Computer Interface
3小时前
待确认
Physics-Informed Neural Networks for SAM Image Enhancement with a Novel Physics-Constrained Metric for Advanced Semiconductor Packaging Inspection
3小时前
待确认
Novel Packaging Platform Based on Bridge Dies with Top and Bottom I/O Connections on Standard Substrates
3小时前
待确认
Development of Glass Core Build-up Substrate with TGV
3小时前
已完结
An Effective 3D Thermal Network Integrated with Deep Learning for Improved Prediction of the 3D Thermal Properties of Complex Packaging Patterns
3小时前
待确认
Direct-to-Silicon Liquid Cooling Integrated on Cowos® Platform
3小时前
已完结
Pathfinding for Molybdenum Hybrid Metallization
6个月前
已完结
DTCO Guided Process Integration: Case Studies From FEOL & BEOL with BSPDN Topic: DTCO/DFM
6个月前
已完结
Study and reduction of the surface pits in 4H-SiC epitaxial wafer
7个月前
已完结
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