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52 积分 2025-07-10 加入
一种新型芯片连接材料，具有高芯片剪切强度和高耐热性能，适用于更明亮的LED器件
2天前
已完结
Highly Reliable WLEDs With All-Inorganic Packaging Structure by Soldering Phosphor-in-Glass IEEE Photonics Technology Letters
2天前
已完结
Highly Reliable WLEDs With All-Inorganic Packaging Structure by Soldering Phosphor-in-Glass
20天前
已完结
Selective Coating of White Silicone to Improve the Optical and Thermal Characteristics of White LED Packages
20天前
已完结
Enhanced luminous efficiency of multilayer gradient refractive index phosphor in P2O5-ZnO-B2O3-BaO glass for white light-emitting diode packages
29天前
已完结
Effects of copper and silver coated aluminum heat sink on operating performance for COB LED thermal management
1个月前
已完结
Gradient Thermal and Optical Phosphor-in-Glass for High-Performance LEDs
1个月前
已关闭
Highly Reliable WLEDs With All-Inorganic Packaging Structure by Soldering Phosphor-in-Glass
1个月前
已完结
Optimization of the thermal distribution of multi-chip LED package
1个月前
已完结
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