Lv12
32 积分 2024-06-21 加入
Effect of Novel pH Regulators on Copper film Chemical Mechanical Polishing for Ruthenium-Based Copper Interconnect under Weak Alkalinity Conditions
1小时前
待确认
Chemical roles on Cu-slurry interface during copper chemical mechanical planarization
1小时前
已完结
Analysis of removal mechanism on oxide CMP using mixed abrasive slurry
21小时前
已完结
Mechanical effect of colloidal silica in copper chemical mechanical planarization
23小时前
已完结
Angstrom surface on copper induced by novel green chemical mechanical polishing using ceria and silica composite abrasives
1天前
已完结
A novel slurry for Cu films CMP in Ru-based Cu interconnects: Integration of experimental and theoretical calculations
2个月前
已完结
Effects of R-Group Functionalized Amino Acid Inhibitors on the CMP Performance of Copper Films: Experimental and Atomistic Insights
2个月前
已完结
Effect of Sulfur-Containing Corrosion Inhibitors on the Selection Ratio of Removal Rate for Ruthenium Based Copper Interconnects
3个月前
已完结
A novel slurry for Cu films CMP in Ru-based Cu interconnects: Integration of experimental and theoretical calculations
3个月前
已完结
Effect of Sulfur-Containing Corrosion Inhibitors on the Selection Ratio of Removal Rate for Ruthenium Based Copper Interconnects
4个月前
已完结
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