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28 积分 2024-06-21 加入
Effects of R-Group Functionalized Amino Acid Inhibitors on the CMP Performance of Copper Films: Experimental and Atomistic Insights
4个月前
已完结
Optimization of polishing fluid composition for single crystal silicon carbide by ultrasonic assisted chemical-mechanical polishing
7个月前
已完结
Effect of Novel pH Regulators on Copper film Chemical Mechanical Polishing for Ruthenium-Based Copper Interconnect under Weak Alkalinity Conditions
7个月前
已完结
Chemical roles on Cu-slurry interface during copper chemical mechanical planarization
7个月前
已完结
Analysis of removal mechanism on oxide CMP using mixed abrasive slurry
7个月前
已完结
Mechanical effect of colloidal silica in copper chemical mechanical planarization
7个月前
已完结
Angstrom surface on copper induced by novel green chemical mechanical polishing using ceria and silica composite abrasives
7个月前
已完结
A novel slurry for Cu films CMP in Ru-based Cu interconnects: Integration of experimental and theoretical calculations
10个月前
已完结
Effects of R-Group Functionalized Amino Acid Inhibitors on the CMP Performance of Copper Films: Experimental and Atomistic Insights
10个月前
已完结
Effect of Sulfur-Containing Corrosion Inhibitors on the Selection Ratio of Removal Rate for Ruthenium Based Copper Interconnects
11个月前
已完结
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