Lv2
149 积分 2024-10-25 加入
Enabling record-high heat flux in wide-bandgap electronics via in-chip microfluidic cooling on diamond substrates
1个月前
已完结
Thermal Management Verification Platform for Chiplet Functional Unit
2个月前
已完结
The study of embedded microfluidic cooling for chip thermal management at KW/cm2 level
2个月前
已完结
Electrochemical additive manufacturing-based cold plate with distributed inlet nozzles and outlet slots for high-power-density electronics cooling
3个月前
已完结
Enhanced heat transfer characteristics and energy efficiency of ceramic manifold micro-channels for automobiles high-power IGBT cooling
6个月前
已完结
Multi-objective optimization and performance analysis of micro-jet heat sink with variable height pin fin and variable density jet orifice
7个月前
已完结
Enhanced cooling performance of HCPV modules using non-uniform wavy channel designs
7个月前
已完结
Thermal Electromagnetic Co-Design of a MultiChip Radio Frequency Front-End System-in-Package With Embedded Microchannel Cooling
7个月前
已完结
Experimental and numerical investigation of 3D printed water-cooled ceramic manifold microchannel heat sinks
7个月前
已完结
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