Lv1
30 积分 2025-12-24 加入
Study on micro-crack induced cutting of 4H-SiC, sapphire and Si along tetrahedral micro-crater tips
1个月前
已完结
Multi-phase modeling of SiC particle removal mechanism in ultrasonic vibration–assisted scratching of SiCp/Al composites
1个月前
已完结
Influence of diamond abrasives on material removal of single crystal SiC in mechanical dicing
1个月前
已完结
Experimental study of plastic cutting in laser-assisted machining of SiC ceramics
1个月前
已完结
Mechanistic study of 4H-SiC removal under various scratching speeds using nano-scratching experiments and molecular dynamics simulations
3个月前
已关闭
Atomistic insights into burr formation and thermo-mechanical behavior in nano-scratching of 3C-SiC
5个月前
已完结
Chipping size in Si and SiC wafers dicing with a diamond saw blade – A review
6个月前
已完结
Study of Suborbital Rocket Plane Using Highly Pressurized Hydrogen/Nitrous Oxide
6个月前
已完结
Preparation and interface mechanical performance of Ni-graphene-diamond dicing blade considering noncoherent phase boundary effects
6个月前
已完结
Preparation and dicing performance of a novel 3D printed ultra-fine Fe-assisted ultra-thin diamond dicing blade
6个月前
已关闭