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50 积分 2025-12-24 加入
Atomistic insights into burr formation and thermo-mechanical behavior in nano-scratching of 3C-SiC
1个月前
已完结
Chipping size in Si and SiC wafers dicing with a diamond saw blade – A review
1个月前
已完结
Study of Suborbital Rocket Plane Using Highly Pressurized Hydrogen/Nitrous Oxide
2个月前
已完结
Preparation and interface mechanical performance of Ni-graphene-diamond dicing blade considering noncoherent phase boundary effects
2个月前
已完结
Preparation and dicing performance of a novel 3D printed ultra-fine Fe-assisted ultra-thin diamond dicing blade
2个月前
已关闭
Modeling and verifying of sawing force in ultrasonic vibration assisted diamond wire sawing (UAWS) based on impact load
2个月前
已完结
Analysis of the Sawing Process With Abrasive Circular Saw Blades
4个月前
已关闭
Investigation of chipping and wear of silicon wafer dicing
4个月前
已完结
A predictive model of the critical undeformed chip thickness for ductile–brittle transition in nano-machining of brittle materials
4个月前
已完结
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