Lv41
689 积分 2022-08-16 加入
Formation of through-glass vias (TGVs) in glass substrates using femtosecond laser operating in MHz/GHz burst mode
1小时前
已完结
Fabrication and analysis of through-glass vias for glass-based electronic packaging using an ultrashort pulsed laser
3小时前
待确认
Challenges and opportunities in glass processing with MHz/GHz burst mode femtosecond laser
3小时前
待确认
Formation of through-glass vias (TGVs) in glass substrates using femtosecond laser operating in MHz/GHz burst mode
4小时前
已完结
Research on a Glass Core Substrate Based on TGV Technology
4小时前
已完结
Modulation of high-quality internal multifoci based on modified three-dimensional Fourier transform
1个月前
已完结
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