Lv11
80 积分 2023-09-07 加入
Ultrahigh-solid-content silica/epoxy composite for high-performance semiconductor packaging
24分钟前
已完结
APS-silane modification of silica nanoparticles: effect of treatment’s variables on the grafting content and colloidal stability of the nanoparticles
6天前
已完结
Design of sandwich structure conductive polypropylene/styrene‐butadiene‐styrene triblock copolymer/carbon black composites with inherent morphological tunability
1个月前
已完结
A novel hollow ZnO microspheres/organosilicone composite for potential application in electronic packaging fields
3个月前
已完结
Mechanisms of biochar-mediated promotion of acidogenic fermentation in waste activated sludge and propionic acid production pathways
3个月前
已关闭
Structure-property relationships between microscopic filler surface chemistry and macroscopic rheological, thermo-mechanical, and adhesive performance of SiO2 filled nanocomposite underfills
3个月前
已完结
Preparetion and properties of SiO2 filled underfills with controllable chemical groups on the surface of filler
3个月前
已关闭
Formulation design of a new type of epoxy resin-based insulating adhesive and research on its high temperature resistance
3个月前
已完结
Liquid metal-based soft, hermetic, and wireless-communicable seals for stretchable systems
3个月前
已完结
Condensation and hydrophobicity of the surface hydroxyl groups between organosilane modified water glass and microsilica
3个月前
已完结
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