Lv4
540 积分 2023-09-30 加入
GaN smart power IC technology
8天前
已完结
Stacked VCSEL Integration in PPG Sensor for Enhanced Optical Signal Collection
16天前
已完结
Embedding of Chips for System in Package realization - Technology and Applications
1个月前
已完结
Stacked VCSEL Integration in PPG Sensor for Enhanced Optical Signal Collection
1个月前
已完结
Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging
2个月前
已完结
HyFET—A GaN/SiC Hybrid Field-Effect Transistor
2个月前
已完结
Thermal and Mechanical Finite Element Analysis of Stacking Co-packaged GaN/SiC Device
2个月前
已完结
Sandwich-structured thermal interface material based on Cu foam for advanced thermal management in high-power devices
3个月前
已完结
Design and Evaluation of a Face-Down Embedded SiC Power Module With Low Parasitic Inductance and Low Thermal Resistance
6个月前
已完结
皖公网安备34019202002308
