Lv4
500 积分 2023-09-30 加入
GelSight Svelte: A Human Finger-shaped Single-camera Tactile Robot Finger with Large Sensing Coverage and Proprioceptive Sensing
1个月前
已完结
Study of underfill-to-soldermask delamination in flip-chip packages
2个月前
已完结
In Situ Growth of Fe3O4 Nanoparticles in Poly(arylene ether nitrile)/Graphene/Carbon Nanotube Foams for Electromagnetic Interference Shielding
3个月前
已完结
CoaxMIL 2.0 – Next Generation Coaxial Magnetic Integrated Inductors for Higher Efficiency Fully Integrated Voltage Regulator
3个月前
已完结
High-Efficiency PCB-Embeddable Inductor for Vertical Power IVR Applications
3个月前
已完结
Chiplet Design and Heterogeneous Integration Packaging
3个月前
已完结
Study of a Packaging Technology for Ultra Compact Double-Side Cooled Power Module with Power Chip Size Package
4个月前
已完结
GaN smart power IC technology
7个月前
已完结
Stacked VCSEL Integration in PPG Sensor for Enhanced Optical Signal Collection
7个月前
已完结
Embedding of Chips for System in Package realization - Technology and Applications
8个月前
已完结
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