Lv41
520 积分 2023-09-30 加入
Chiplet Design and Heterogeneous Integration Packaging
3小时前
待确认
Study of a Packaging Technology for Ultra Compact Double-Side Cooled Power Module with Power Chip Size Package
1个月前
已完结
GaN smart power IC technology
4个月前
已完结
Stacked VCSEL Integration in PPG Sensor for Enhanced Optical Signal Collection
4个月前
已完结
Embedding of Chips for System in Package realization - Technology and Applications
5个月前
已完结
Stacked VCSEL Integration in PPG Sensor for Enhanced Optical Signal Collection
5个月前
已完结
Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging
5个月前
已完结
HyFET—A GaN/SiC Hybrid Field-Effect Transistor
5个月前
已完结
Thermal and Mechanical Finite Element Analysis of Stacking Co-packaged GaN/SiC Device
6个月前
已完结
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