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6 积分 2025-12-17 加入
Nickel conductive adhesive based on bisphenol A epoxy resin modified by CTBN/dicyclopentadiene epoxy resin: Effects of epoxy resin structure on mechanical properties and thermal stability
2个月前
已完结
Superstable, High-Conductivity Cu Conductive Adhesive
2个月前
已完结
Surface treatment of micron silver flakes with coupling agents for high-performance electrically conductive adhesives
3个月前
已完结
Preparation and curing behavior of latent 2‐PhIm‐PS microcapsule curing agent for epoxy resin
3个月前
已完结
Latent imidazole curing agents by microencapsulation with copolymers
3个月前
已完结
Preparation and characterization of a novel microcapsule-type latent curing agent for epoxy resin
3个月前
已完结
Tailoring the active sites in Cu-SSZ-13 as a catalyst for the selective catalytic reduction of NH3 to minimize HCHO and HCN emissions
6个月前
已完结
Enhanced thermal conductivity of fluorinated epoxy resins by incorporating inorganic filler
6个月前
已完结
Epoxy casting used as nonhermetic encapsulation technique for implantable electronic devices
6个月前
已完结
A DOPO-based phosphorus-nitrogen flame retardant bio-based epoxy resin from diphenolic acid: Synthesis, flame-retardant behavior and mechanism
6个月前
已完结
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