Lv1
8 积分 2025-12-17 加入
Surface treatment of micron silver flakes with coupling agents for high-performance electrically conductive adhesives
3天前
已完结
Preparation and curing behavior of latent 2‐PhIm‐PS microcapsule curing agent for epoxy resin
29天前
已完结
Latent imidazole curing agents by microencapsulation with copolymers
29天前
已完结
Preparation and characterization of a novel microcapsule-type latent curing agent for epoxy resin
29天前
已完结
Tailoring the active sites in Cu-SSZ-13 as a catalyst for the selective catalytic reduction of NH3 to minimize HCHO and HCN emissions
3个月前
已完结
Enhanced thermal conductivity of fluorinated epoxy resins by incorporating inorganic filler
3个月前
已完结
Epoxy casting used as nonhermetic encapsulation technique for implantable electronic devices
3个月前
已完结
A DOPO-based phosphorus-nitrogen flame retardant bio-based epoxy resin from diphenolic acid: Synthesis, flame-retardant behavior and mechanism
3个月前
已完结
Mechanical Properties of Epoxy Matrix Composites Toughened by Liquid Epoxidized Natural Rubber (LENR)
3个月前
已完结
Synthesis and Characterization of a Self-Polycondensation Diazaphthalanone Monomer and Its Polymers from Polycondensation Reactions
3个月前
已完结
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