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1510 积分 2022-03-25 加入
Effect of Ti on Microstructure and Properties of Tungsten Heavy Alloy Joint Brazed by CuAgTi Filler Metal
19秒前
求助中
Material removal and interactions between an abrasive and a SiC substrate: A molecular dynamics simulation study
22小时前
待确认
Mechanical removal of SiC by multi-abrasive particles in fixed abrasive polishing using molecular dynamics simulation
23小时前
待确认
The material removal mechanism in mechanical lapping of diamond cutting tools
23小时前
待确认
AFM Observation of Initial Oxidation Stage of 4H-SiC (0001) in Electrochemical Mechanical Polishing
1天前
待确认
The Polishing Effect of SiC Substrates in Femtosecond Laser Irradiation Assisted Chemical Mechanical Polishing (CMP)
1天前
待确认
Investigation on the Material Removal and Surface Generation of a Single Crystal SiC Wafer by Ultrasonic Chemical Mechanical Polishing Combined with Ultrasonic Lapping
1天前
待确认
Interfacial Microstructure and Mechanical Properties of Pressureless Sintered SiC Ceramic and Stainless Steel Joints Brazed by AgCu/AgCuTi Alloy
1天前
已关闭
Smoothing of reaction sintered silicon carbide using plasma assisted polishing
1天前
待确认
Polishing single-crystal silicon carbide with porous structure diamond and graphene-TiO2 slurries
1天前
待确认
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