Lv11
40 积分 2024-06-29 加入
Application of direct bonded copper substrates for prototyping of power electronic modules
1小时前
已完结
Modelling of radiation transfer in metallic powders at laser treatment
15天前
已完结
Microscopic Dynamics of Liquid Aluminum Oxide
16天前
已完结
Preparation of micron size copper powder with chemical reduction method
21天前
已完结
Thermal conductivity of copper films
21天前
已完结
Fabrication of 10 µm-scale conductive Cu patterns by selective laser sintering of Cu complex ink
29天前
已完结
A thin-film broadband perfect absorber based on plasmonic copper nanoparticles
29天前
已完结
Fabrication of 10 µm-scale conductive Cu patterns by selective laser sintering of Cu complex ink
1个月前
已完结
A Novel Fabricating a Thick Film Cu-Ni Alloy Resistor by Screen Printing an Al Electrode and Galvanic Replacement Reaction
1个月前
已完结
An alumina ceramic inspired high temperature wireless chipless sensor for harsh environment
1个月前
已完结
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