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40 积分 2021-08-18 加入
High Resolution Micro-LED Arrays Using Au–Sn Flip-Chip Bonding
3天前
已完结
The improvement of bonding metal layers for high resolution micro-LED display application
3天前
已完结
Investigating the Performance and Reliability of Au-Sn Bonded Flip-Chip Micro-LEDs
1个月前
已完结
Investigation of Adhesion Force of Silver and Gold-Coated Surfaces with Different Thicknesses on Silicon Substrate
3个月前
已完结
Investigation of Adhesion Force of Silver and Gold-Coated Surfaces with Different Thicknesses on Silicon Substrate
3个月前
已关闭
Precise quantification of the adhesion between metallic thin films and silicon wafer
3个月前
已完结
金属/半导体欧姆接触机理和特性研究
3个月前
已关闭
Improving Viewing Angle Characteristics of Top-Emission Micro-Cavity OLEDs with Randomly Distributed Micro Lens Arrays
5个月前
已完结
Highly Efficient Amorphous Polymer‐Based Ultralong Phosphorescence Enabled by Intense Repulsive Interactions
5个月前
已完结
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