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Studies of the Thermal Conductivity and Thermal Resistance of Solder Layers with Lead-Free Pastes by the Photodeflection Method
1小时前
求助中
Modulation of the interfacial thermal resistances of the w-AlN/Graphene/3C-SiC interface by nanoscale nonplanar feature structures
1小时前
已完结
Studies of the Thermal Conductivity and Thermal Resistance of Solder Layers with Lead-Free Pastes by the Photodeflection Method
2小时前
已关闭
Electrophoretic deposition of CNTs on a Cu foam interlayer for enhancing Cf/SiC-Nb brazed joint performance
4小时前
已完结
Performance and reliability of nanoparticle-reinforced lead-free solder composite joints
4小时前
已完结
Research progress of nanoparticles reinforced composite filler metal
4小时前
已关闭
Forming a disordered atomic layer to bond TiN or AlN ceramic with Sn 9Zn metal under ultrasonication
6小时前
已完结
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