Lv71
4963 积分 2021-09-17 加入
新型硅基扇出型封装的关键技术研究
1小时前
已完结
Large language models to accelerate organic chemistry synthesis
1个月前
已完结
Development of ion-exchanged waveguides with low-bend radii and crossing angles in commercial thin glass for co-packaged optical sensors in glass core substrate
3个月前
已完结
焊锡接点金属间化合物(IMC)微结构演化与微观—宏观力学行为关系研究
4个月前
已完结
三维电子封装关键结构TSV-Cu的胀出行为研究
4个月前
已完结
Reliability Implications of Thermo-Mechanically and Electrically Induced Interfacial Sliding of Through-Silicon Vias in 3D Packages
5个月前
已完结
Detachable fiber connectivity solution for co-packaged optics and advanced semiconductor packaging integration (Conference Presentation)
5个月前
已关闭
Microsensing of plutonium with a glass optofluidic device
5个月前
已完结
8-inch Wafer Level Through Glass Via (TGV) Interposer with 110-GHz Bandwidth Facing 128-GBaud 2.5D Co-Packaged Optics (CPO)
5个月前
已完结
Simulation and Metrological Applications for RDL Patterning Development of Glass Substrate
5个月前
已完结
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