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36 积分 2026-01-01 加入
Laser‐Direct Printed 2D Material‐Based Heterostructure for the Fabrication of Electronic Devices
1天前
已完结
Melting-assisted assembly of twisted graphene/h-BN superlattices with clean interfaces
1天前
已完结
Melting-assisted assembly of twisted graphene/h-BN superlattices with clean interfaces
7天前
已完结
Moving Beyond Scotch Tape: Scalable Transfer of Research-Grade CVD Graphene
7天前
已完结
Patterning Halide Perovskite Monocrystalline Arrays via Dry Imprinting Transfer
10天前
已完结
Moving Beyond Scotch Tape: Scalable Transfer of Research-Grade CVD Graphene
10天前
已完结
Se-mediated dry transfer of wafer-scale 2D semiconductors for advanced electronics
1个月前
已完结
Data for: Exfoliation and transfer of millimetre-sized MoS2 flakes on arbitrary substrates
1个月前
已关闭
Mechanism of Gold-Assisted Exfoliation of Centimeter-Sized Transition-Metal Dichalcogenide Monolayers
1个月前
已完结
200-mm-wafer-scale integration of polycrystalline molybdenum disulfide transistors
1个月前
已完结
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