Lv11
16 积分 2023-09-13 加入
Residual Stress Testing and Simulation Analysis of Crystal Structures of Electronic Device Materials
7小时前
待确认
Random Vibration Fatigue - A Study Comparing Time Domain and Frequency Domain Approaches for Automotive Applications
1个月前
已完结
Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals
3个月前
已完结
Vibration and shock reliability of MEMS: modeling and experimental validation
3个月前
已完结
Interfacial reaction and IMC growth kinetics at the Bi2Te3/Ag interface during isothermal aging
4个月前
已完结
Interfacial Imc Growth Behavior of Sn-3ag-3sb-Xin Solder on Cu Substrate
4个月前
已完结
Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters
4个月前
已完结
Electromigration in metals
4个月前
已完结
A framework for combined simulations of electromigration induced stress evolution, void nucleation, and its dynamics: Application to nano-interconnect reliability
4个月前
已完结
Effect of the critical size of initial voids on stress-induced migration
6个月前
已完结
皖公网安备34019202002308
